无锡得力电子有限公司
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2023年11月01日 16:57
BL-R8188EU1(EUS)
Product Specification
WLAN 11b/g/n USB MODULE
Approval Sheet
Customer Date Product Type BL-R8188EU1 Part NO. Blink Approve Field
ENGINEER
QC
SALES Customer Approve Field
ENGINEER
QC
MANUFACTORY
PURCHASING
Content
TOC o "1-3" h z u Content. PAGEREF _Toc410027559 h 1
0. Revision History. PAGEREF _Toc410027560 h 2
1. General Description. PAGEREF _Toc410027561 h 2
2. The range of applying. PAGEREF _Toc410027562 h 2
3. Product Specification. PAGEREF _Toc410027563 h 2
3.1 Function Block diagram.. PAGEREF _Toc410027564 h 2
3.2 Electrical and Performance Specification. PAGEREF _Toc410027565 h 3
3.3 DC Characteristic. PAGEREF _Toc410027566 h 3
3.4 RF Characteristic. PAGEREF _Toc410027567 h 4
3.5 Product Photo. PAGEREF _Toc410027568 h 5
3.6 Mechanical Specification. PAGEREF _Toc410027570 h 5
3.7 Product Pin Definition. PAGEREF _Toc410027571 h 6
4. Supported platform.. PAGEREF _Toc410027572 h 7
5. Peripheral Schematic Reference Design. PAGEREF _Toc410027573 h 7
6. Package Information. PAGEREF _Toc410027574 h 8
7. Typical Solder Reflow Profile. PAGEREF _Toc410027575 h 8
8. Precautions for use. PAGEREF _Toc410027576 h 9
0. Revision History Date Document
revision Product
revision Change Description 2014/06/18 1.0 V2.7 Update format , change product size tolerance. 1. General Description
BL-R8188EU1 product is designed base on Realtek RTL8188EUS chipset .It combines CMOS MAC, Baseband PHY and RF in a single chip for IEEE 802.11/b/g/n compatible. It supports IEEE802.11i safety protocol, along with IEEE 802.11e standard service quality. It supports the new data encryption on 64/128 bit WEP and safety mechanism on WPA-PSK/WPA2-PSK, WPA/WPA2. It can implement the wireless network function on the laptop/desktop/MID and other wireless devices easily . This module has implemented some efficient mechanisms in its software and hardware to maximize the performance.
2. The range of applying
MID, networking camera, STB GPS, E-book, Hard disk player, Network Radios, PSP and other device which need be supported by wireless networking.
3. Product Specification
3.1 Function Block diagram
3.2 Electrical and Performance Specification Item Description Product Name BL-R8188EU1 Major Chipset RTL8188EUS Host Interface USB2.0 Standard IEEE 802.11b, IEEE 802.11g,IEEE 802.11n, Frequency Range 2.4GHz~2.4835GHz Modulation Type 802.11b: CCK, DQPSK, DBPSK
802.11g: 64-QAM,16-QAM, QPSK, BPSK
802.11n:64-QAM,16-QAM, QPSK, BPSK Working Mode Infrastructure, Ad-Hoc Data Transfer Rate 1,2,5.5,6,11,12,18,22,24,30,36,48,54,60,90,120 and
maximum of 150Mbps Spread Spectrum IEEE 802.11b: DSSS (Direct Sequence Spread Spectrum)
IEEE 802.11g/n:OFDM (Orthogonal Frequency Division
Multiplexing) Sensitivity @PER 1M: -90dBm@8%PER
6M: -88dBm@10%PER
11M:-86dBm@8%PER
54M:-73dBm@10%PER
135M:-68dBm@8%PER RF Power(Typical) 16dBm@11b, 14dBm@11g , 13dBm@11n, Antenna type Connect to the external antenna through the half hole The transmit distance Indoor 100M, Outdoor 300M, according the local environment Dimension(L*W*H) 13.0 x 12.3 x 1.55mm (LxWxH) ;Tolerance: +-0.2mm Power supply 3.3V +/-0.2V Power Consumption standby mode ,
TX mode Clock source 40MHz Working Temperature 0°C to +50°C Storage temperature -40°C ~ +85°C 3.3 DC Characteristic Terms Contents Specification : IEEE802.11b Mode DSSS / CCK Frequency 2412 – 2484MHz Data rate 1, 2, 5.5,11Mbps DC Characteristics min Typ. max. unit TX mode 257 263 271 mA Rxmode 80 82 84 mA Sleepmode 78 80 82 mA Specification : IEEE802.11g Mode OFDM Frequency 2412- 2484MHz Data rate 6, 9, 12, 18, 24, 36, 48, 54Mbps DC Characteristics min Typ. max. unit TX mode 244 245 245 mA Rxmode 88 89 89 mA Sleepmode 78 80 82 mA Specification : IEEE802.11n Mode OFDM Frequency 2412- 2484MHz Data rate 6.5,13, 19.5,26, 39, 52, 58.5, 65Mbps DC Characteristics min Typ. max. unit TX mode 201 207 214 mA Rxmode 90 93 94 mA Sleepmode 78 80 82 mA 3.4 RF Characteristic Mode Rate(Mbps) Power(dBm) EVM(dB) Sensitivity(dBm) CH1 CH7 CH13 CH1 CH7 CH13 CH1 CH7 CH13 11b 1 17.43 17.36 17.20 -28.27 -28.11 -27.86 -95 -94 -94 11 17.91 17.77 17.68 -23.42 -24.02 -24.21 -86 -86 -86 11g 6 15.39 15.22 15.33 -32.02 -31.43 -31.17 -90 -90 -90 54 14.79 14.81 15.11 -33.03 -32.63 -32.31 -74 -73 -73 11n
HT20 MCS0 15.02 15.12 15.33 -32.14 -31.66 -32.88 -90 -90 -90 MCS7 14.75 14.67 14.66 -32.40 -31.29 -31.60 -70 -70 -70
Mode Rate(Mbps) Power(dBm) EVM(dB) Sensitivity(dBm) CH3 CH7 CH11 CH3 CH7 CH11 CH3 CH7 CH11 11n
HT40 MCS0 15.52 15.53 15.33 -32.54 -31.47 -32.49 -88 -88 -88 MCS7 14.65 14.6 14.76 -32.51 -31.39 -31.92 -68 -68 -68
3.5 Product Photo
TOP Bottom
3.6 Mechanical Specification
Module dimension: Typical (L x W x H): 13mmx12.3mmx1.55mm Tolerance : +/-0.2mm
3.7 Product Pin Definition
4. Supported platform Operating System CPU Framework Driver WIN2000/XP/VISTA/WIN7 X86 Platform Enable LINUX2.4/2.6 ARM, MIPSII Enable WINCE5.0/6.0 ARM ,MIPSII Enable
5. Peripheral Schematic Reference Design
6. Package Information
7. Typical Solder Reflow Profile
8. Precautions for use 1. Pls handle the module under ESD protection. 2. Reflow soldering shall be done according to the solder reflow profile. Peak temperature 245℃. 3. Products require baking before mounting if humidity indicator cards reads >30% temp <30 degree C, humidity < 70% RH, over 96 hours. Baking condition: 125 degree C, 12 hours Baking times: 1 time 4. Storage Condition: Moisture barrier bag must be stored under 30 degree C, humidity under 85% RH. The calculated shelf life for the dry packed product shall be a 12 months from the bag seal date. Humidity indicator cards must be blue, <30%.
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