供应阿尔法助焊剂NR330

ALPHA NR330无挥发免洗助焊剂 VOC-FREE1 NO-CLEAN FLUX GENERAL DESCRIPTION ALPHA NR330, former lab development #9225, is a VOC-free halide-free, rosin/resin-free, low solids no-clean flux which provides the highest activity of any VOC-free Bellcore compliant flux for defect-free soldering. It is formulated with a proprietary mixture of organic activators which deliver excellent wetting and top-side hole fill, even with OSP coated bare copper boards which have undergone prior thermal excursions. Several proprietary additives are also formulated into ALPHA NR330 which act to reduce the surface tension between the solder mask and the solder; thereby, dramatically reducing the tendency of solderball generation. The formulation of ALPHA NR330 is also designed to be more thermally stable; thereby, reducing the occurrence of solder bridging. FEATURES & BENEFITS ? Bellcore compliant for assemblies requiring this standard. ? VOC-free to help meet air quality regulations. ? Exceptional wetting for excellent hole-fill even with organically coated bare copper boards, with prior reflows. ? Thermally stable activators provide low solder bridging. ? Reduces the surface tension between solder mask and solder to provide low solderball frequency. ? Very low level of non-tacky residue to reduce interference with pin testing and good board cosmetics. ? Suitable for use with lead-free alloys such as 99.3Sn/0.7Cu and 96.5Sn/3.5Ag. APPLICATION GUIDELINES PREPARATION - In order to maintain consistent soldering performance and electrical reliability, it is important to begin the process with circuit boards and components that meet established requirements for solderability and ionic cleanliness. It is suggested that assemblers establish specifications on these items with their suppliers and that suppliers provide Certificates of Analysis with shipments and/or assemblers perform incoming inspection. A common specification for the ionic cleanliness of incoming boards and components is 5μg/in 2 maximum, as measured by an Omegameter with heated solution. Care should be taken in handling the circuit boards throughout the process. Boards should always be held at the edges. The use of clean, lint-free gloves is also recommended. Conveyors, fingers and pallets should be cleaned. Bioact SC-10 Solvent Cleaner has been found to be very useful for these cleaning applications. FLUX APPLICATION - NR330 is formulated to be applied by spray method. When spray fluxing, the uniformity of the coating can be visually checked by running a piece of cardboard over the spray fluxer or by processing a board-sized piece of tempered glass through the spray and then through the preheat section. Physical Properties Typical Values Parameters/Test Method Typical Values Appearance Clear, Colorless Liquid pH 2.35 Solids Content, wt/wt 4.0 Recommended Thinner DI Water Specific Gravity @ 25°C (77°F) 1.013 ± 0.003 Shelf Life 18 months Acid Number (mg KOH/g) 38.0 ± 2.0 Container Size Availability 1, 5 and 55 Gal. Flash Point (T.C.C.) NONE IPC J-STD-004 Designation ORL0