厂家直销含铅锡膏63/37 SMT贴片锡膏 针筒型锡膏

锡膏产品是现代印刷电路板级电子组装技术——表面组装技术用之最重要的连接材料。完全适合SMT表面贴装的要求，尤其对精细间距元器件（QFP、CSP、BGA）的焊接有优良的效果。

产品特点如下. 1、采用进口锡粉。 2、锡粉的氧化程度极少 3、品质优良，焊接能力强, 免洗型产品的残留物极少 4、具有良好的印刷性、稳定性和粘性 5、有针对BGA产品而设计的配方，可解决焊接BGA方面的难题。 6、IC引脚爬升性好，吃锡饱满 7、少锡珠及立碑现象.

Solder paste products is modern printed circuit board level electronic assembly technology, surface mount technology materials of the most important connection. Completely suitable for SMT SMT requirement, especially for fine pitch components (QFP, CSP, BGA) welding has a good effect.

Product features are as follows: 1, using imported tin powder. 2, tin powder, oxidation degree few. 3, good quality, welding ability, few residue in disposable products. 4, good printing, the stability and viscosity. 5, is there a formula for BGA products designed, can solve the problems of BGA welding ways. 6, IC pin climb sex good, eat a tin full. 7, less tin beads and made a phenomenon.