仿OSRAM 红外点阵灯源850nm红外大功率红外阵列灯源 特价产品

'台湾晶元35mil芯片，可媲美OSRAM：SFH-4232效果，工作电流1A,导热效果绝佳。

JNJ-LOJI0113W140

n Features（特征）

1)Dimension: Top

封装外形:表面贴装型

2) Excellent heat conductive assembly.

极佳导热封装方式

3)High radiant intensity.

高光功率强度发射

4)Wide viewing angle.

140度宽角度发光

5)Soldering methods: IR

reflow soldering

焊接方式:红外热风回流焊

6)The product itself will remain within RoHS

符合ROHS相关标准

n Applications(典型应用)

The best light surveillance cameras

监控摄像机最理想光源

n Package Dimensions( 封装尺寸 )

Notes:

1.All dimensions are in millimeters .

（单位：毫米）

2.Tolerance is±0.1 unless otherwise noted.

(允差: ±0.1 ,另有标注除外.)

3.Specifications are subject to change without notice.

(规格若有变动,恕不另行通知）

n Elecrto-optical Characteristics at 25℃:ParameterSymbolConditionMin.Typ.Max.UnitForward voltageVf1If=10uA 1.0 VVf2If=350mA 1.51.9VReverse currentIfVr=10V 5.0uAPeak wavelengthλpIf=350mA840855870nmRadiant fluxPoH11If=350mA190200220mWn Absolute Maximum Ratings(Ta=25℃):ParmeterSymbolAbsolute maximum RatingUnitForward DC currentIf≤1000mAReverse voltageVr≤10VPower DissipationPd2000mWOperation TemperatureTopr-20~+75℃Storage TemperatureTstg-30~+80℃Temperature during Soldering---280(<10sec)℃

n Characteristic Curves:

n Application Notes

Storage

Before opening the package,the LEDs should be kept under the condition <30℃ and < 90%RH.After opening the package,the LEDs should be stored under the condition <30℃ and < 70%RH.The LEDs should be used within a year.And afer opening the package,The LEDs should be used within 168hours(7 days).If the desiccant is faded or the LEDs have exceeded the storage time,Re-baking is required under the condition 60±6℃ for 24 hours.The lens of LEDs is prone to attact dust so the relevant steps should be taken to keep the emitter free of dust.

n Handling

Handle the component along the side surfaces by using forceps or appropriate tools. The forceps or other appropriate tools should not put any pressure on the lens.it’s also strictly forbidden to poke and press the lens.

n Thermal Management

When the LED is drived by large current.the TJ(junction temperature)will exceed its limit.which will shorten lifetime of LEDs seriously.The thermal management should effectively reduce the resistance of products.

The general way foe the thermal management is to mount the LED on a metal core printed circuit board(MCPCB).It is recommended that the surface area of the MCPCB is at least 20 cm2 for 1W LED(and 30cm2 foe 3W LED),while we recommend using an additional heat sink,and the MCPCB heat-conducting adhesive with a thermal conductivity greater than 3.0W/mK.The thermal glue or paste should with a thermal conductivity greater than 3.0W/mK and its thickness must be less than 100um.

n Claning

When cleaning is necessary,using clean soft cloth and dipping the isopropyl alcohol to erasure the dirt gently.Do not clean it with the solvents such as Acetone,lest erode or destroy the LEDs.

n Electrical Notes

The LED can not be drived reversely.It’s necessary to have the measures to limit the current Otherwise slight voltage shift may cause enormous current change and results in the failure of LEDs.It is recommended that the drive current should be lower when the light output is enough for applying.It would be helpful to improve the product’s reliability.

n Antistatic

The LEDs are electrostatic sensitive devices,so antistatic steps should be taken during the processing.

n Reflow Solding Profile for lead free solding

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