上海晶合电子材料有限公司
主营产品:
2023年10月11日 17:00
加工定制 |
是 |
我们厂生产加工半导体级生长外延层抛光硅片
Diameter 2 inch
Growth Method CZ/FZ
diffused layer Conductivity Type P/N
diffused layer Dopant B, P, AS
diffused layer Resistivity: customization
diffused layer Thickness: Customization
substrate layer Conductivity Type P/N
substrate layer Dopant B, P, AS
substrate layer Resistivity: 0.001-1,1-1000,1000-10000
substrate layer Thickness Customization
substrate layer Crystal orientation: or customization
Surface: No scratch, no saw mark, no chip, no stain
Single side/double sides polished
Packing Aluminum foil vacuum packing
Particle
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