高通QCA4004 低功耗WIFI串口模块

'Product Specification

CONTENTS

0REVESION HISTORY3

1INTRODUCTIONS4

1.1OVERVEIW4

1.2PRODUCT BLOCK DIAGRAM4

1.3PRODUCT FEATURES5

2GENERAL SPECIFICATION5

2.1WIFI RF SPECIFICATION5

2.2SLEEP STATE MANAGEMENT6

2.3POWER CONSUMPTION7

3MECHANICAL SPECIFICATION8

3.1OUTLINE DRAWING8

3.2PIN DEFINITION8

4ENVIRONMENTAL REQUIREMENTS10

4.1 OPERATING & STORAGE CONDITIONS10

4.2 RECOMMENDED REFLOW PROFILE10

4.3 NOTICE10

5PACKING INFORMATION11

5.1 BLISTER PACKAGING11

0. Revision History

REV NODateModificationsDraftRev0.12014-6-26First ReleasedSJ LI

1. Introduction

1.1 Overview

The QCA4004 is a single chip 1x1 802.11b/g/n MIMO solution optimized for low-power embedded applications with single-stream capability for both transmit and receive. Frame aggregation, reduced inter-frame spacing (RIFS), and half guard intervals provide improved throughput on the link. Additional 802.11n performance optimization, such as 802.11n frame aggregation (A-MPDU and A-MSDU), is provided by drivers that support SDIO bus transaction bundling (a form of bus aggregation) and low-overhead host assisted buffering (Rx A-MSDU and A-MPDU). These techniques can improve the performance and efficiency of applications involving large bulk data transfers (for example, file transfers or high-resolution video streaming). The typical data path consists of the host interface, mailbox DMA, AHB, memory controller, MAC, BB, and radio. The CPU drives the control path via register and memory access. External interfaces include USB LPM or SPI slave, reference clock, and front-end components, as well as optional connections such as UART, SPI/I2C, GPIO, JTAG. See the “System Block Diagram”

1.2 Product Block Diagram

1.3 Product Features

◆ All-CMOS IEEE 802.11b/g/n 1x1 single-chip

◆ Support TCP/UDP IP protocol

◆ Support Smartconfig

◆ USB 2.0 at 480 Mbps using an integrated controller and PHY

◆ Extensive hardware support for WLAN coexistence through LPC message passing

◆ Power and clock management for extended battery life

◆ Green-Tx power saving

◆ Low-power listen mode and radio retention for reduced receive power consumption and sleep current

◆ Support for transmit beam formee (TxBFee)

◆ Integrated PA, LNA minimizing external component count

◆ Optional external PA, LNA support

◆ Data rates of up to 54 Mbps for 802.11g and 72.2 for 802.11n HT20, 150 Mbps for HT40

◆ Advanced power management to minimize standby, sleep and active power

◆ Security support for WPS, WPA2, WPA, WAP and protected management frames

◆ Block ACK

◆ GPIO/PWM/UART for console support

◆ JTAG-based processor debugging supported

2. GENERAL SPECIFICATION

2.1 WiFi RF SpecificationsFeaturesDescriptionsMain ChipsetQCA4004Frequency Range2.400～2.484GHz Operating Voltage3.3Vdc ±10% supply voltageHost InterfaceWiFi: UART / SPIStandardsWiFi:

IEEE 802.11b,

IEEE 802.11g,

IEEE 802.11n, ModulationWiFi:

802.11b: CCK(11, 5.5Mbps), QPSK(2Mbps), BPSK(1Mbps),

802.11 g/n: OFDMPHY Data ratesWiFi:

802.11b: 11,5.5,2,1 Mbps

802.11g: 54,48,36,24,18,12,9,6 Mbps

802.11n: up to 150MbpsTransmit Output PowerWiFi:

802.11b@ 1Mbps 15±2dBm

802.11b@11Mbps 15±2dBm

802.11g@6Mbps 15±2dBm

802.11g@54Mbps 13±2dBm

802.11n@65Mbps 15±2dBm (MCS 0_HT20)

13±2dBm (MCS 7_HT20)

15±2dBm (MCS 0_HT40)

13±2dBm (MCS 7_HT40)EVM802.11b /11Mbps : EVM≦-9dB

802.11g /54Mbps : EVM≦-27dB

802.11n /MCS 7 : EVM≦-28dBReceiver Sensitivity

(HT 20)802.11b@8% PER

1Mbps -90±1dBm

2Mbps -88±1dBm

5.5Mbps -86±1dBm

11Mbps -84±1dBm802.11g@10% PER

6Mbps -86±1dBm

9Mbps -85±1dBm

12Mbps -84±1dBm

18Mbps -82±1dBm

24Mbps -80±1dBm

36Mbps -77±1dBm

48Mbps -73±1dBm

54Mbps -71±1dBm802.11n@10% PER

MCS 0 -83±1dBm

MCS 1 -82±1dBm

MCS 2 -80±1dBm

MCS 3 -78±1dBm

MCS 4 -75±1dBm

MCS 5 -71±1dBm

MCS 6 -69±1dBm

MCS 7 -67±1dBmOperating ChannelWiFi 2.4GHz:

11: (Ch. 1-11) – United States(North America)

13: (Ch. 1-13) – Europe

14: (Ch. 1-14) – Japan Media Access ControlWiFi: CSMA/CA with ACK Network ArchitectureWiFi: Ad-hoc mode (Peer-to-Peer )

Infrastructure mode

Software AP

WiFi Direct SecurityWiFi: WPS, WPA2, WPA, WAP Antenna Onboard antennaOS SupportedAndroid /Linux/ Win CE /iOS /XP/WIN7DimensionTypical L32.0*W18.0*T3.0mm

2.2 Sleep State Management

StateDescriptionsOFFCHIP_PWD_L pin assertion immediately brings the chip to this state.Sleep clock is disabled.No state is preserved.SLEEPOnly the sleep clock is operating.The crystal or oscillator is disabled.Any wakeup events (MAC, host, LF timer, GPIO interrupt) force a transition to WAKEUP.All internal states are maintained.WAKEUPThe system transitions from sleep/OFF states to ON.The high frequency clock is gated off as the oscillator is brought up and the PLL is enabled.WAKEUP duration is usually 2 ms.ONThe high speed clock is operational and sent to each block enabled by the clock control register.Lower-level clock gating is implemented at the block level, including the CPU, which can be gated off using WAITI instructions while the system is on. No CPU, host, or WLAN activities go to sleep.

2.3 Power Consumption (unit: mA)

STATUSPower ConsumptionPower ON (Standby)70TX POWERHT2011n MCS0 TX25011n MCS7 TX22011g 6M TX25011g 54M TX23011b CCK1M TX28011b CCK11M TX275HT4011n MCS0 TX25011n MCS7 TX220RX POWER105SLEEP7DISABLE7

3. Mechanical Specification

3.1 Outline Drawing (Unit: ±0.15mm)

3.2 PIN Assignment

Pin #NameDescription1GNDGROUND2VDDIO_HOST3.3V Power3GPIO13GPIO4GPIO12GPIO5GPIO11/UART1_TXDTXD16GPIO10/UART1_RXDUART1_RXD7GPIO6GPIO8GPIO5GPIO9GNDGROUND10GPIO9/I2C_SDAI2C DATA11GPIO8/I2C_SCKI2C CLOCK12GPIO7/UART0_TXDTXD013VDD333.3V Power14USB_DPUSB D+15USB_DNUSB D-16GPIO4GPIO17GPIO3GPIO18GPIO2/UART0_RXDRXD19GPIO1GPIO20GPIO0GPIO21CHIP_PWDCHIP ENABLE22WAKEUPWake-up23GPIO16/SPI_CSNC24GPIO15/SPI_CLKNC25GNDGROUND26DVDD333.3V Power27GPIO17/SPI_DINC28GPIO18/SPI_DONC29GPIO19/SPI_WPNC30GPIO20/SPI_HOLDNC31GPIO21/PWM_OUTPWM_OUTPUT32GPIO31GPIO33GNDGROUND34,36GNDRF Ground35EXT_ANT2NC

4. Environmental Requirements

4.1 Operating& Storage ConditionsOperatingTemperature: 0°C to +55°CRelative Humidity: 10-90% (non-condensing)StorageTemperature: -40°C to +80°C (non-operating)Relative Humidity: 5-90% (non-condensing)

4.2 Recommended Reflow Profile

Referred to IPC/JEDEC standard.

Peak Temperature : <250°C

Number of Times : ≤2 times

4.3 Patch WIFI modules installed before the notice:

WIFI module installed note:

1. Please press 1 : 1 and then expand outward proportion to 0.7 mm, 0.12 mm thickness When open a stencil

2. Take and use the WIFI module, please insure the electrostatic protective measures.

3. Reflow soldering temperature should be according to the customer the main size of the products, such as the temperature set at 250 + 5 ℃ for the MID motherboard.

About the module packaging, storage and use of matters needing attention are as follows:

1. The module of the reel and storage life of vacuum packing: 1). Shelf life: 8 months, storage environment conditions: temperature in: < 40 ℃, relative humidity: < 90% r.h.

2. The module vacuum packing once opened, time limit of the assembly:

Card: 1) check the humidity display value should be less than 30% (in blue), such as: 30% ~ 40% (pink), or greater than 40% (red) the module have been moisture absorption.

2.) factory environmental temperature humidity control: ≦ 30% ℃, ≦ 60% r.h..

3). Once opened, the workshop the preservation of life for 168 hours.

3. Once opened, such as when not used up within 168 hours:

1). The module must be again to remove the module moisture absorption.

2). The baking temperature: 125 ℃, 8 hours.

3.) After baking, put the right amount of desiccant to seal packages.'