供应供???格斯sil pad 900S?焊?C?Ｓ梦?z布

导热绝缘材料事业部 >> 贝格斯导热绝缘材料 >> Sip-Pad 900S低紧固压力高绝缘的应用

特点和好处 热阻抗0.61℃-in2/W(@50psi) 低紧固压力 光滑和高度适应的表面 电气绝缘性 Sil-Pad 900S系列导热绝缘材料设计用于高导热绝缘的应用。这些应用一般采取较低紧固压力的元件固定方式。 Sil-Pad 900S高度适应度的光滑表面，具有高的导热性，这个特征使得在低压力下界面的热阻减至***小。 低紧固压力的应用包括用簧片固定的分散半导体器件。簧片固定安装迅速但施加在半导体上的压力有限，Sil-Pad 900S的光滑表面将界面热阻减至***小，从而得到的热性能。

典型应用

电源、汽车电子、马达控制、功率半导体

TYPICAL PROPERTIES OF SIL-PAD 900S PROPERTY IMPERIAL＆#118alue METRIC＆#118alue TEST METHOD Color Pink Pink Visual Reinforcement Carrier Fiberglass Fiberglass ─ Thickness(inch)/(mm) 0.009 0.229 ASTM D374 Hardness(Shore A) 92 92 ASTM D2240 Elongation(%45ºto Warp & Fill) 20 20 ASTM D412 Tensile Strength(psi)/(Mpa) 1300 9 ASTM D412 Continuous Use Temp(ºF)/(℃) -76 to 356 -60 to 180 ─ ELECTRICAL Dielectric Breakdown Voltage(Vac) 5500 5500 ASTM D149 Type 3 Electrodes 8300 8300 ASTM D149 Dielectric Constant(1000Hz) 6.0 6.0 ASTM D150 Volume Resistivity(Ohm-meter) 1010 1010 ASTM D257 Flame Rating 94V-O 94V-O U.L THERMAL Thermal Conductiviy(W/m-K) 1.6 a1.60.61 ASTM D5470 THERMAL PERFORMANCE vs PRESSURE Pressure(psi) 10 25 50 100 200 TO-220 Thermal Performance(℃/W) 3.96 3.41 2.90 2.53 2.32 Thermal Impedance(℃-in2/W) (1) 0.95 0.75 0.61 0.47 0.41 1）The ASTM5470(Bergquist modified)test fixture was used and the testsample was conditioned at 70℃ prior to test.Therecorded ＆#118alue includes interfacial thermal resistance.These ＆#118alue are provided for referrnce omly.Actual application performance isdirectly related to the surface roughness.flatness an d pressure applied.

可供规格：

片材、模切、卷材、带胶和不带胶