供应品牌锡膏膏体、焊膏

DH325是专用于生产SMT无铅锡膏，完全替代国产助焊膏不足的焊接活性助焊膏，采用日本优级原材料研制合成，制作产品可以满足客户不同产品的工艺要求,适用生产各种合金粉焊锡膏见(表1) DH325lead-freesolder paste is a dedicated lead-free solder paste on the SMTproduction process welding activity to help paste, using superiorgrade Japanese development of synthetic materials to produceproducts to meet customer process requirements of differentproducts suitable for producing all kinds of alloy powder paste,see(Table1) 一、产品特性： 1、本产品是免清洗焊膏，几乎无残留，无需清洗。

2、极少残留物是无色透明的,快干不粘手,较高的绝缘阻抗,不会腐蚀PCB。

3、优良印刷优良的性能，适用于手工和机器印刷。

4、连续印刷性能稳定，其粘度变化极小,钢网上操作寿命可长达8小时以上,保持良好的印刷性能。

5、可适用不同档次的焊接设备要求,在较宽的回流焊炉内表现良好的焊接性能。

6、能够适应0.3mm间距印刷要求。

7、良好的润湿性能，有效解决冷焊点等不良现象。

8、湿度曲线的技术，减少对各种曲线的依赖。

9、焊后无锡珠、不连锡。

10、锡点，光泽度好，强度高，良好的电气性能。

11、尤其是柔性电路，预热时间可能很短，,都可达到优良的焊接效果。12、本焊膏生产的成品,湿润性好,抗发干性和防冷热塌陷极好。 一, theproduct features:

1、This product is no-clean solder paste, very little residue, nocleaning.

2:、The residue is colorless and transparent, quick-drying non-stickin hand, high insulation resistance,corrosion will not be PCB.

3:、fine print excellent performance, suitable for hand and machineprinting.

4、Continuous printing performance is stable, its viscosity changesvery little, the steel line operating life of up to 8 hours, andmaintain good printing performance.

5:、applicable to different grades of welding equipmentrequirements, the performance of a wide reflow furnace good weldingperformance.

6、able to adapt to 0.3mm pitch printing requirements.

7、good wetting properties, an effective solution to cold solderjoints and other undesirable phenomena.

8、humidity curve technology to reduce dependence on the variouscurves.

9、very little very little corrosion after welding residual solderball.

10、tin point, good gloss, high strength, good electricalperformance.

11、in particular, flexible circuits, preheating time may be veryshort, can achieve good welding effect.

12、The production of finished paste, moist and good, anti-hair dryand anti-collapse excellent hot and cold.

二、合金粉配比(表1)合金成份焊膏比例合金成份焊膏比例Sn96.5Ag3.0Cu0.511-11.5Sn42Bi5810.8-11.3Sn99Ag0.3CU0.711-11.5Sn63Pd3710-10.5 三、使用/注意1、焊膏保存温度在常温5-20℃，勿接近高温处。2、使用前将焊膏搅拌均匀，倒入合金粉搅拌。3、搅拌时间根据合金粉份量来定，参考时间:（搅拌机搅拌5-12分钟）.4、搅拌温度控制20-25℃，在搅拌过程中合金粉磨擦会产生温度会上升，注意观查合金粉变化。5、手工搅拌要在干燥无尘环境中操作，使用不锈钢材料搅拌。勿使用其它金属成份接触锡膏。Third,use / attention1, pastestored at room temperature, the temperature 5-20℃,not to close to heat.

2 Stir before using the paste, stirring into the alloypowder.

3, stirring time under the weight of alloy powder to set, referencetime: (Mixer 5-12 minutes).

4, mixing temperature control 20-25℃,the alloy powder in the mixing process will produce frictionbetween the temperature will rise, pay attention to changes in viewof investigation alloy powder.

5,hand mixing in dry air to operate, so that stainless steelmixing.Do not use the othermetal components contact solder paste.